Product Overview

The 310 × 310 mm sapphire heat dissipation substrate is a large-size thermal and insulating substrate made from high-purity single crystal sapphire. It offers excellent thermal conductivity, electrical insulation, high-temperature resistance, chemical stability, and mechanical strength.

This product is suitable for high-power electronic devices, LED packaging, semiconductor processing carriers, optoelectronic components, laser modules, and precision thermal management structures.

Compared with conventional glass, ceramic, or metal substrates, sapphire provides a unique combination of heat dissipation, electrical insulation, high hardness, and long-term stability in demanding operating environments.

Key Features

Large Size Design

With a size of 310 × 310 mm, the substrate is suitable for large-area device packaging, batch chip carrying, customized thermal structures, and high-power module applications.

Excellent Thermal Performance

Sapphire provides good heat transfer capability, helping devices dissipate heat efficiently, reduce operating temperature, and improve reliability and service life.

High Electrical Insulation

As an excellent insulating material, sapphire enables effective thermal conduction while maintaining electrical isolation, making it ideal for power electronics and high-voltage applications.

High Temperature and Corrosion Resistance

Sapphire offers outstanding resistance to high temperatures and chemical corrosion, allowing stable performance in harsh processing and operating environments.

High Hardness and Mechanical Strength

With high hardness and excellent wear resistance, sapphire is resistant to scratches, deformation, and mechanical damage, making it suitable for precision and cleanroom applications.

Custom Processing Available

The substrate can be customized according to customer drawings, including polishing, grinding, chamfering, hole drilling, slotting, edge shaping, and special structure processing.

Typical Applications

• High-power LED heat dissipation substrates
• Semiconductor packaging carrier plates
• Laser and optoelectronic device thermal components
• Power electronics insulating heat spreaders
• Wafer processing carrier plates
• High-temperature process support plates
• Precision optical and electronic structural parts
• Customized large-size sapphire panels

Standard Specification Reference