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Veja Por Que Escolher Equipamentos Laser Microfluídicos para Processamento de Bolachas de Semicondutores

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December 16, 2025
Conexão de Categoria: equipamento de laboratório científico
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Tags:
#medidor uv do transmitância #Medidor leve do transmitância #medidor da transmissão clara
Resumo: Neste passo a passo, destacamos ideias-chave de design e como elas se traduzem em desempenho.Veja como o Microfluidic Laser Equipment usa um jato de água fino para guiar a energia do laser para processamento de wafer de semicondutoresDescubra como este método híbrido de micromecânica reduz os danos causados pelo calor, evita a contaminação e melhora a qualidade das bordas em materiais duros e frágeis como as wafers de SiC e GaN.
Recursos de Produtos Relacionados:
  • Hybrid micromachining method coupling a thin water jet with a laser beam for precise energy delivery.
  • Total internal reflection guiding mechanism ensures accurate laser beam transmission to the workpiece.
  • Continuous cooling and debris removal during processing for a cleaner, more stable operation.
  • Reduces heat-affected damage, contamination, oxidation, and microcracks in semiconductor materials.
  • Supports various laser wavelengths (1064 nm, 532 nm, 355 nm) and power levels up to 200 W.
  • Configurable nozzle diameters from 30-150 μm using sapphire or diamond materials.
  • High-precision positioning with accuracy up to ±5 μm and repeatability of ±2 μm.
  • Applicable to advanced packaging, wafer dicing, chip drilling, and defect repair processes.
Perguntas Frequentes:
  • What is microjet laser technology?
    Microjet laser technology is a hybrid micromachining process where a thin, high-velocity water jet guides a laser beam using total internal reflection, delivering precise energy to the workpiece while providing continuous cooling and debris removal.
  • What are the key advantages of microjet laser processing versus dry laser processing?
    Key advantages include reduced heat-affected damage, less contamination and redeposition, lower risk of oxidation and microcracks, minimized kerf taper, and improved edge quality on hard and brittle semiconductor materials.
  • Which semiconductor materials are best suited for microjet laser processing?
    It is particularly well-suited for hard and brittle materials like silicon carbide (SiC) and gallium nitride (GaN), as well as silicon wafers, ultra-wide-bandgap materials such as diamond and gallium oxide, and selected advanced ceramic substrates.
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