Máquina de Corte com Fio Diamantado para SiC Safira Quartzo Vidro

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Máquina de Corte com Fio Diamantado para SiC Safira Quartzo Vidro

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August 19, 2025

Conexão de Categoria: equipamento de laboratório científico

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#medidor uv do transmitância #Medidor leve do transmitância #medidor da transmissão clara

Resumo: Discover the Diamond Wire Cutting Machine for SiC Sapphire Quartz Glass, an advanced solution for slicing ultra-hard materials with high precision. Ideal for semiconductors, photovoltaics, and gemstone finishing, this machine offers high-speed, low-damage cutting with minimal kerf loss.

Recursos de Produtos Relacionados:

High-speed diamond wire cutting up to 1500 m/min for efficient material processing.
Precision feed control with servo-driven system ensures micron-level accuracy.
Continuous coolant and cleaning system reduces thermal effects and debris.
Automatic wire tension adjustment maintains consistent cut thickness.
Versatile cutting options including straight, curved, and multi-slice synchronous cuts.
Expandable functions like rotary worktables for angled and circular slicing.
Durable mechanical design with heavy-duty casting for long-term accuracy.
Touchscreen interface with smart parameter storage for easy operation.

Perguntas Frequentes:

What materials can the Diamond Wire Cutting Machine process?

The machine is optimized for SiC, sapphire, quartz, silicon, ceramics, glass, and gemstones.
How accurate is the cutting process?

For a 6-inch SiC wafer, cutting accuracy can reach less than 3 μm, ensuring excellent flatness and surface quality.
What makes diamond wire cutting better than traditional methods?

Compared to abrasive wire or laser cutting, it offers higher speed, reduced kerf loss, lower thermal stress, and superior edge quality.