Vidro de vias transversais (VTT)

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Vidro de vias transversais (VTT)

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May 31, 2024

Conexão de Categoria: carcaça da safira

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#bolacha da safira #carcaça de silicone #material da safira

Resumo: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.

Recursos de Produtos Relacionados:

Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
Adaptável para wafers de até 200mm de diâmetro.
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.

Perguntas Frequentes:

What is Through Glass Via (TGV) technology?

TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
Quais são as aplicações do TGV em semicondutores?

Nos semicondutores, a tecnologia TGV é usada para integração de alta densidade, desempenho de alta frequência e melhor estabilidade térmica e mecânica em aplicações como 5G, IoT e embalagens de sensores.
What materials are compatible with TGV technology?

TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.

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